W. Price

Subtractive W contact and local interconnect co-integration (CLIC)

Michael A. Guillorn, Eric A. Joseph, Sebastian U. Engelmann, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Ta/polyimide adhesion durability

S. Purushothaman, A. Callegari, B. Furman, 1992, ESSDERC '92: 22nd European Solid State Device Research conference.

ESTABLISHING A TI-CU-PT-AU THIN FILM ? ON ? LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TECHNOLOGY FOR HIGH TEMPERATURE ELECTRONICS.

P. Vianco, B. McKenzie, J. M. Grazier, 2015 .

Application of cyclic fluorocarbon/argon discharges to device patterning

E. Joseph, Yu Zhu, S. Engelmann, 2016 .

Dopant-Segregation Technique for Leakage Reduction and Performance Improvement in Trigate Transistors Without Raised Source/Drain Epitaxy

Josephine B. Chang, M. Khater, M. Guillorn, 2014, IEEE Electron Device Letters.