K. Sinha

Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects

S. Solares, A. Dasgupta, J. Caers, 2009, 2009 59th Electronic Components and Technology Conference.

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

A. Dasgupta, R. Beaupre, A. Gowda, 2008 .

Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

S. Solares, J. Caers, X.J. Zhao, 2014 .

Trapping atoms using nanoscale quantum vacuum forces

H. Kimble, J. Taylor, D. Chang, 2013, Nature Communications.

Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics

Koustav Sinha, John W. Evans, K. Sinha, 2018, Microelectron. Reliab..

Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices

Koustav Sinha, Joe Varghese, Abhijit Dasgupta, 2014, Microelectron. Reliab..

Mechanics of Non Planar Interfaces in Flip-Chip Interconnects

Koustav Sinha, K. Sinha, 2012 .