S. Hong

Cantilever beam micro-contacts in a multi-chip interconnection system

T. P. Weihs, J. Bravman, S. Hong, 1989, Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,.

Measuring stiffnesses and residual stresses of silicon nitride thin films

Timothy P. Weihs, William D. Nix, John C. Bravman, 1990 .

Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films

Timothy P. Weihs, William D. Nix, John C. Bravman, 1988 .

Influence of nanometer-scale copper filaments in niobium on mechanical and superconducting properties

B. Kear, R. Zhou, S. Hong, 1993 .