S. Mermoz
发表
F. Fournel,
F. Gigon,
E. Deloffre,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
E. Deloffre,
V. Balan,
S. Moreau,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
Microelectronic Engineering.
Brian J. Brown,
F. Pitard,
S. Gaillard,
2015,
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
S. Monfray,
F. Leverd,
F. Boeuf,
2022,
Optical Fiber Communications Conference and Exhibition.
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
L. Arnaud,
F. Fournel,
A. Farcy,
2017,
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
Sebastien Mermoz,
Jean Berthier,
Kenneth A. Brakke,
2015
.
Pierric Gueguen,
Rachid Taibi,
Sebastien Mermoz,
2012
.
Léa Di Cioccio,
E. Deloffre,
Loic Sanchez,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
S. Moreau,
L. Sanchez,
P. Gueguen,
2014
.
Léa Di Cioccio,
Loic Sanchez,
Jean Berthier,
2013
.
F. Fournel,
L. Di Cioccio,
E. Augendre,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.