B. Rábay

发表

E. Auerswald, J. Rudzki, D. Wargulski, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

B. Wunderle, D. May, M. A. Ras, 2022, International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.