Hsiao-Chun Chang

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2016, 2016 IEEE International Symposium on Circuits and Systems (ISCAS).

An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2017, IEEE Transactions on Electron Devices.

Integration of neural sensing microsystem with TSV-embedded dissolvable µ-needles array, biocompatible flexible interposer, and neural recording circuits

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2016, 2016 IEEE Symposium on VLSI Technology.

Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2017, IEEE Transactions on Biomedical Circuits and Systems.