Arnita Podpod

Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

Yu-Rong Jian, Ferenc Fodor, Erik Jan Marinissen, 2018, 2018 IEEE International Test Conference (ITC).

Picking large thinned dies with high topography on both sides

Eric Beyne, Andy Miller, Gerald Beyer, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Eric Beyne, Andy Miller, John Slabbekoorn, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).