A. Marks

发表

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

R. Durairaj, Nduka Nnamdi (Ndy) Ekere, S. Mallik, 2009 .

A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection

R. Durairaj, Nduka Nnamdi (Ndy) Ekere, S. Mallik, 2007, 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.

Investigation of Wall-slip Effect on Paste Release Characteristic in Flip chip Stencil Printing Process

R. Durairaj, Nduka Nnamdi (Ndy) Ekere, S. Mallik, 2008, 2008 10th Electronics Packaging Technology Conference.

Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance

A. Marks, Antony Edward, 2012 .