Fengtian Hu

Effects of Cu orientation on the microstructure of Sn-2Ag-2.5Zn /Cu interface

Anmin Hu, Ming Li, Penghui Xu, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Superhydrophobic and anti-corrosion Cu microcones/Ni–W alloy coating fabricated by electrochemical approaches

Anmin Hu, Ming Li, Haozhe Wang, 2015 .

Research on the interfacial reaction and mechanism of Cu/Sn/Ni copper pillar bump

Anmin Hu, Liming Gao, Ming Li, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Mitigation of tin whisker growth by inserting Ni nanocones

Ming Li, Anmin Hu, Menglong Sun, 2017 .

Low-Temperature Copper Bonding Strategy with Graphene Interlayer.

J. Kong, Ming Li, Ju Li, 2018, ACS nano.

Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces

Ming Li, T. Hang, Huiqin Ling, 2018, Electronic Materials Letters.

Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding

Ming Li, Haozhe Wang, Fengtian Hu, 2015, Journal of Electronic Materials.

Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces

Ming Li, Haozhe Wang, Fengtian Hu, 2015 .