S. Bhattacharya

Development of low viscosity, high dielectric constant (k) polymers for integral passive applications

R. Tummala, C. Wong, T. S. Troutman, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Low-cost large area processing using small area substrates-a novel multitiled palletization concept for MCM-D thin film process

R. Tummala, D. Baldwin, J. Qu, 2000 .

MEMS composite structures for tunable capacitors and IC-package nano interconnects

R. Tummala, F. Ayazi, P. Raj, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Development of high performance interfill materials for system chips technology

H. B. Pogge, R. Tummala, Jiali Wu, 2002 .

Evaluation and characterization of high-performance filling encapsulants for system chips application

H. B. Pogge, R. Tummala, C. Wong, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Low temperature (<100/spl deg/C) hydrothermal synthesis of high K-low loss BaTiO/sub 3/ films for integral capacitors

R. Tummala, P. Kohl, D. Balaraman, 2002, 4th Electronics Packaging Technology Conference, 2002..

Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications

M. Swaminathan, D. Balaraman, M. Sacks, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Low-cost embedded capacitor technology with hydrothermal and sol-gel processes

R. Tummala, D. Balaraman, M. Sacks, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

PWB compatible high value integral capacitors by MOCVD

A. Erbil, O. Misman, R. Tummala, 2000 .

Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

Pulugurtha Markondeya Raj, Rao Tummala, D. Balaraman, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications

R. Tummala, D. Balaraman, P. Raj, 2003 .

Novel hydrothermal processing (<100/spl deg/C) of ceramic-polymer composites for integral capacitor applications

D. Balaraman, P. Markondeya Raj, R. Tummala, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

I.R. Abothu, S. Bhattacharya, D. Balaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).