P. Feldmann

The necessity and consequences of modeling driver and load nonlinearity in on-chip global interconnect noise verification

P. Feldmann, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Kaltkanaldüse minimiert Angussabfall bei der Duroplastverarbeitung

Walter Michaeli, P. Feldmann, T. Kloubert, 1994 .

The SyMPVL algorithm and its applications to interconnect simulation

P. Feldmann, R.W. Freund, R. Freund, 1997, SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest.

Are on-chip power-ground planes really needed? A signal integrity perspective

P. Feldmann, I.M. Elfadel, H. Chen, 2004, Electrical Performance of Electronic Packaging - 2004.

Session details: Variation-aware modelling of gates and interconnects

P. Feldmann, W. Schilders, 2008, DATE '08.

Proof of the number of independent Kirchhoff equations in an electrical circuit

R. A. Rohrer, P. Feldmann, R. Rohrer, 1991 .

MAISE: An Interconnect Simulation Engine for Timing and Noise Analysis

Frank Liu, P. Feldmann, 2008, ISQED 2008.