Terence Kane

Emerging Failure Modes of Advanced Technology

Terence Kane, 2012 .

Session 7: Defect Characterization and Metrology

Terence Kane, 2013 .

Session 13: Defect Analysis

Terence Kane, 2012 .

Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects

Cathryn Christiansen, Baozhen Li, Terence Kane, 2011, 2011 International Reliability Physics Symposium.

Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes

Wei Wang, Raghuveer Patlolla, Elbert Huang, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Electromigration in aluminum damascene lines

Terence Kane, Ronald G. Filippi, Kenneth P. Rodbell, 1999 .