F. Le Henaff

Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization

S. Azzopardi, E. Woirgard, S. Bontemps, 2015, 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP).

Lifetime Evaluation of Nanoscale Silver Sintered Power Modules for Automotive Application Based on Experiments and Finite-Element Modeling

E. Woirgard, S. Azzopardi, S. Bontemps, 2015, IEEE Transactions on Device and Materials Reliability.

First assemblies using Deep Trench Termination diodes

E. Woirgard, S. Azzopardi, F. Baccar, 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

Processing and characterization of a 100% low-temperature Ag-sintered three-dimensional structure

J. Delétage, S. Azzopardi, E. Woirgard, 2013, 2013 15th European Conference on Power Electronics and Applications (EPE).