M. Seckel
发表
A. Ostmann,
T. Loher,
M. Seckel,
2010,
3rd Electronics System Integration Technology Conference ESTC.
A. Pitilakis,
O. Tsilipakos,
A. Tasolamprou,
2022,
2204.03962.
Tom Sterken,
Frederick Bossuyt,
J. de Vries,
2011,
Microelectron. Reliab..
Marco A. Antoniades,
Fu Liu,
Nikolaos V. Kantartzis,
2020,
IEEE Access.
Andreas Ostmann,
Christine Kallmayer,
Thomas Löher,
2019,
2019 IEEE CPMT Symposium Japan (ICSJ).
M. Schneider-Ramelow,
R. Aschenbrenner,
A. Ostmann,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
A. Ostmann,
T. Loher,
2009,
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
Christine Kallmayer,
Thomas Löher,
Andreas Ostmann,
2009,
2009 International Symposium on Wearable Computers.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 IEEE 9th VLSI Packaging Workshop of Japan.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
A. Ostmann,
T. Loher,
M. Seckel,
2014,
IEEE CPMT Symposium Japan 2014.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.