Michael J. Degerstrom

A zero sum signaling method for high speed, dense parallel bus communications

Barry K. Gilbert, Erik S. Daniel, Robert W. Techentin, 2012 .

A Unique Transmission Line Model Which is Defined by Loss Parameters

Barry K. Gilbert, Clifton R. Haider, Chad M. Smutzer, 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).

Navigating PCB stackup layer assignments for optimized si and pi performance in high speed, high power designs

Barry K. Gilbert, Chad M. Smutzer, Michael J. Degerstrom, 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).

3D Integrated Packaging Approach for High Performance Processor- Memory Module

Barry Kent Gilbert, Michael J. Degerstrom, E. S. Daniel, 2013 .

Practical design considerations for dense, high-speed, differential stripline PCB routing related to bends, meanders and jog-outs

Barry K. Gilbert, Erik S. Daniel, Chad M. Smutzer, 2014 .

High speed parallel signal crosstalk cancellation concept

Barry K. Gilbert, Erik S. Daniel, Chad M. Smutzer, 2011 .

PCB pin-field considerations for 40 Gb/s SerDes channels

Barry K. Gilbert, Erik S. Daniel, Michael J. Degerstrom, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Automating pin field modeling for serdes channel simulations

Barry K. Gilbert, Erik S. Daniel, Michael J. Degerstrom, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

System-level exhaustive link simulation needed for PCB Co-design

Barry K. Gilbert, Erik S. Daniel, Michael J. Degerstrom, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance

Erik S. Daniel, Barry K. Gilbert, P. J. Zabinski, 2001 .

Modeling Metal Surface Roughness with a Single Parameter

Clifton R. Haider, Michael J. Degerstrom, Christopher K. White, 2018, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).