K. Marrant

Dielectric reliability of 70nm pitch air-gap interconnect structures

G. Beyer, H. Bender, F. Sebaai, 2011 .

Isolation and characterisation of rye starch

G. Vandeputte, J. Delcour, K. Marrant, 2004 .

Metrology for Implanted Si Substrate Loss Studies

G. Mannaert, H. Bender, D. Shamiryan, 2010 .

Metrology for Implanted Si Substrate and Dopant Loss Studies

G. Mannaert, E. Rosseel, H. Bender, 2009 .

Barrier and seed repair performance of thin RuTa films for Cu interconnects

Christopher J. Wilson, G. Beyer, E. Sleeckx, 2011 .