Y. Ho

Effects of package type, die size, material and interconnection on the junction-to-case thermal resistance of power MOSFET packages

Xiaotian Zhang, Cong Yue, Jun Lu, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Product distributions in the reactions of excited noble‐gas atoms with hydrogen‐containing compounds

M. Golde, Y. Ho, J. Balamuta, 1983 .

Chemi‐ionization reactions of metastable Ar(3P0,2) atoms

H. Ogura, M. Golde, Y. Ho, 1982 .

Chemi‐ionization reactions of state‐selected electronically excited Ar(3P0) and Ar(3P2) atoms

M. Golde, Y. Ho, 1985 .