Steven Xu

Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

Ahmer Syed, Tong Cui, Beth Keser, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array

Steven X. Xu, Ahmer Syed, Tong Cui, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).