Chung-Shi Liu
发表
Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes
Yen-liang Lin,
Douglas Yu,
Chung-Shi Liu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Tiao-Yuan Huang,
Tsung-Yi Huang,
Jone F. Chen,
2008
.
Douglas Yu,
Chien-Fu Tseng,
Chung-Shi Liu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Douglas Yu,
Douglas C. H. Yu,
Shu-Rong Chun,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Douglas C. H. Yu,
Jiun-Yi Wu,
Chung-Shi Liu,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Doug C. H. Yu,
Chuei-Tang Wang,
Kai-Chiang Wu,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).