G. Leal

Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation

S. Sitaraman, I. Schmadlak, S. Raghavan, 2014, IEEE transactions on device and materials reliability.

Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests

S. Sitaraman, I. Schmadlak, S. Raghavan, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability

S. Sitaraman, I. Schmadlak, S. Raghavan, 2016 .

The Redistributed Chip Package: A Breakthrough for Advanced Packaging

B. Keser, C. Amrine, Trung Duong, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Advanced Packaging: The Redistributed Chip Package

B. Keser, C. Amrine, Trung Duong, 2007, IEEE Transactions on Advanced Packaging.