G. Leal
发表
S. Sitaraman,
I. Schmadlak,
S. Raghavan,
2014,
IEEE transactions on device and materials reliability.
S. Sitaraman,
I. Schmadlak,
S. Raghavan,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Sitaraman,
I. Schmadlak,
S. Raghavan,
2016
.
B. Keser,
C. Amrine,
Trung Duong,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
B. Keser,
C. Amrine,
Trung Duong,
2007,
IEEE Transactions on Advanced Packaging.