Tetsu Tanaka

发表

Overview of 3D Integration Technology and Challenges for Volume Production

Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, 2012 .

High-Density Through Silicon Vias for 3-D LSIs

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2009, Proceedings of the IEEE.

Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system

Takafumi Fukushima, Tetsu Tanaka, Zhengyang Qian, 2018 .

Urban multipath propagation delay characteristics in mobile communications

Tetsu Tanaka, Shigeru Kozono, Akira Akeyama, 1991 .

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

(Invited) Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration

Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, 2016 .

Development of Biosignal Recording Board System with Agile Control of Circuit Characteristics for Various Biosignals

Tetsu Tanaka, Koji Kiyoyama, Tetsu Tanaka, 2018 .

HIGH ENDURANCE NON-VOLATILE SEMICONDUCTOR MEMORY FOR FULLY IMPLANTABLE RETINAL PROSTHESIS

Tetsu Tanaka, Hisashi Kino, 2012 .

様々な生体信号を瞬時に選択記録可能なアジャイル生体信号記録用ボードシステムの開発;様々な生体信号を瞬時に選択記録可能なアジャイル生体信号記録用ボードシステムの開発;Development of Biosignal Recording Board System with Agile Control of Circuit Characteristics for Various Biosignals

Tetsu Tanaka, Koji Kiyoyama, Keita Ito, 2017 .

DEVELOPMENT OF NEW THREE-DIMENSIONAL INTEGRATION TECHNOLOGY FOR RETINAL PROSTHESIS

Jun Deguchi, Mitsumasa Koyanagi, Hiroyuki Kurino, 2006 .

A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Mitsumasa Koyanagi, Kang Wook Lee, Katsuyuki Sakuma, 2009, 2009 IEEE International Conference on 3D System Integration.

Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2010, IEEE Custom Integrated Circuits Conference 2010.

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2016, Micromachines.

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study

Tetsu Tanaka, Takafumi Fukushima, K. W. Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

NEUROMORPHIC ANALOG CIRCUITS FOR THREE-DIMENSIONALLY STACKED VISION CHIP

Jun Deguchi, Mitsumasa Koyanagi, Hiroyuki Kurino, 2006 .

15 ps cryogenic operation of 0.19-μm-LG n+ - p+ double-gate SOI CMOS

Tetsu Tanaka, Toshihiro Sugii, Hiroshi Horie, 1995, Advanced Lithography.

Three-dimensional integration technology and integrated systems

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2009, 2009 Asia and South Pacific Design Automation Conference.

Process Integration for FlexTrateTM

Tetsu Tanaka, Hisashi Kino, Subramanian S. Iyer, 2018, 2018 International Flexible Electronics Technology Conference (IFETC).

Development of Biomedical Integrated Devices Based on Semiconductor Neural Engineering

Tetsu Tanaka, 2013 .

DEVELOPMENT OF LOW-POWER RETINAL PROSTHESIS WITH PHOTODETECTORS AND STIMULUS CURRENT GENERATORS

Jun Deguchi, Mitsumasa Koyanagi, Hiroyuki Kurino, 2006 .

Heterogeneous integration technology for MEMS-LSI multi-chip module

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips

Tetsu Tanaka, Takafumi Fukushima, Zhengyang Qian, 2018, 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS).

A very low area ADC for 3-D stacked CMOS image processing system

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2015, 2015 International 3D Systems Integration Conference (3DIC).

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV

H. Wang, Mitsumasa Koyanagi, Kang Wook Lee, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

A PHOTORECEPTIVE STIMULATOR FOR A RETINAL PROSTHESIS WITH 3D STACKED LSI

Mitsumasa Koyanagi, Hiroyuki Kurino, Tetsu Tanaka, 2009 .

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

A parallel ADC for high-speed CMOS image processing system with 3D structure

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

3D integration technology for 3D stacked retinal chip

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2009, 2009 IEEE International Conference on 3D System Integration.

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University

Tetsu Tanaka, Takafumi Fukushima, K. W. Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Temporary bonding strength control for self-assembly-based 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip

Tetsu Tanaka, Takafumi Fukushima, Zhengyang Qian, 2017, 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS).

High Frequency Characteristics of Dynamic Threshold-Voltage MOSFET (DTMOS) under Ultra-Low Supply Voltage (Special Issue on Ultra-High-Speed IC and LSI Technology)

Tetsu Tanaka, Y. Momiyama, Toshihiro Sugii, 1999 .

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler

Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

High-Speed and Low-Power n^+-p^+ Double-Gate SOI CMOS

Tetsu Tanaka, Toshihiro Sugii, Yoshiharu Tosaka, 1995 .

BIOLOGICALLY INSPIRED VISION CHIP FABRICATED USING 3-DIMENSIONAL INTEGRATION TECHNOLOGY

Mitsumasa Koyanagi, Hiroyuki Kurino, Kang-Wook Lee, 2006 .

DEVELOPMENT OF A FULLY IMPLANTABLE RETINAL PROSTHESIS WITH A THREE-DIMENSIONALLY STACKED LARGE-SCALE INTEGRATED CIRCUIT

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2009 .

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2015, 2015 IEEE International Reliability Physics Symposium.

High density Cu-TSVs and reliability issues

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current

Tetsu Tanaka, Yoshiki Takezawa, Kenji Shimokawa, 2016, 2016 IEEE Biomedical Circuits and Systems Conference (BioCAS).

Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2013, IEEE Transactions on Electron Devices.

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI

Tetsu Tanaka, S. Kimura, Takafumi Fukushima, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2011, Micromachines.

Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current

Tetsu Tanaka, Takafumi Fukushima, Zhengyang Qian, 2017, 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS).

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Tetsu Tanaka, Fumihiro Inoue, Herbert Struyf, 2014, 2014 International 3D Systems Integration Conference (3DIC).

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Effects of Antenna Beam Horizontal Rotating and Beam Tilting on Delay Spread Reduction in Mobile Radio (Special Issue on Land Mobile/Portable Propagation)

Shigeru Kozono, Tetsu Tanaka, Shigeru Aoyama, 1993 .