Ahila Krishnamoorthy

Performance properties in thick film silicate dielectric layers using molecular modeling

Nancy Iwamoto, Ahila Krishnamoorthy, Richard Spear, 2009, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Dielectric constant trends in silicate spin-on glasses

Tao Li, Ahila Krishnamoorthy, Nancy Iwamoto, 2007, SPIE NanoScience + Engineering.

Characterization of line-edge roughness (LER) propagation from resists: underlayer interfaces in ultrathin resist films

Joseph Kennedy, Patrick P. Naulleau, Thomas I. Wallow, 2010, Advanced Lithography.

Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences

Ahila Krishnamoorthy, S. G. Mhaisalkar, A. V. Vairagar, 2004, Microelectron. Reliab..

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects

Ahila Krishnamoorthy, S. G. Mhaisalkar, K. N. Tu, 2006, Microelectron. Reliab..

Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects

J. O. Suh, Ahila Krishnamoorthy, S. G. Mhaisalkar, 2005 .

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

Ahila Krishnamoorthy, Chunxiang Zhu, V. C. Ngwan, 2004 .

Dependence of leakage mechanisms on dielectric barrier in Cu-SiOC damascene interconnects

Ahila Krishnamoorthy, Chunxiang Zhu, V. C. Ngwan, 2004 .

Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

Ehrenfried Zschech, Ahila Krishnamoorthy, S. G. Mhaisalkar, 2005 .

Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method

Ahila Krishnamoorthy, K. Y. Yiang, Won Jong Yoo, 2003 .

Effect of ramp rate on dielectric breakdown in CU-SiOC interconnects

Ahila Krishnamoorthy, K. H. Cheng, 2004 .

Electromigration in copper damascene interconnects : reservoir effects and failure analysis

Ahila Krishnamoorthy, Chih-Hang Tung, A. V. Vairagar, 2005 .

In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

Ehrenfried Zschech, Ahila Krishnamoorthy, S. G. Mhaisalkar, 2004 .

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Valeriy Sukharev, Ehrenfried Zschech, Ahila Krishnamoorthy, 2005, International Journal of Materials Research.

Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

Ahila Krishnamoorthy, Subodh G. Mhaisalkar, A. V. Vairagar, 2004 .