Ningkang Deng

Electrical and Thermal Characteristics of AlGaN/GaN HEMT Devices with Dual Metal Gate Structure: A Theoretical Investigation

Hong Wang, Wenbo Hu, Shengli Wu, 2022, Materials.

First-Principles Study of Electronic Structure, Optical Properties and LO-TO Splitting of GaP

Xian Bin Zhang, Xuyan Wei, GuanQi Wang, 2018, Key Engineering Materials.

Argon Ion Beam Current Dependence of Si-Si Surface Activated Bonding

Hong Wang, Wenbo Hu, Shengli Wu, 2022, Materials.

Effects of surface activation time on Si-Si direct wafer bonding at room temperature

Hong Wang, Wenbo Hu, Shengli Wu, 2021 .

The Investigations of Electronic Structure in Armchair Graphene Nanoribbons Doped B at the Edge

Xian Bin Zhang, Xuyan Wei, GuanQi Wang, 2018, Key Engineering Materials.

Effect of the thickness of amorphous silicon intermediate layer on the thermal transport of silicon/diamond interface

Hong Wang, Wenbo Hu, Shengli Wu, 2023, Results in Physics.

Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation

Wenbo Hu, Y. Qu, Ningkang Deng, 2023, Journal of Materials Engineering and Performance.

A novel center-hybrid pin-fin microchannel heat sink with embedded secondary microchannels for hotspot thermal management

Wenbo Hu, Y. Qu, Ningkang Deng, 2022, International Journal of Thermal Sciences.