Timothy S. Cale

发表

The Use of Conformal Voxels for Consistent Extractions from Multiple Level-Set Fields

David F. Richards, Max O. Bloomfield, Timothy S. Cale, 2005, International Conference on Computational Science.

THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING

Jian-Qiang Lu, Timothy S. Cale, Ronald J. Gutmann, 2008 .

A kinetic transport and reaction model and simulator for rarefied gas flow in the transition regime

Matthias K. Gobbert, Timothy S. Cale, T. Cale, 2006, J. Comput. Phys..

Wafer-Level 3D Integration Technology Platforms for ICs and MEMS

Jian-Qiang Lu, J. J. McMahon, Ronald J. Gutmann, 2005 .

Diameter distribution of thermally evaporated indium metal islands on silicon substrates

Timothy S. Cale, William Hullinger Huber, Joleyn Balch, 2007, SPIE Optics East.

The Combination of Equipment Scale and Feature Scale Models for Chemical Vapor Deposition Via a Homogenization Technique

Christian A. Ringhofer, Matthias K. Gobbert, Timothy S. Cale, 1998, VLSI Design.

Development of microstructure in nanostructures and thin films

Jian Wang, Max O. Bloomfield, Timothy S. Cale, 2003, SPIE Microtechnologies.

Parallel Numerical Solution of the Boltzmann Equation for Atomic Layer Deposition (Research Note)

Jean-François Remacle, Matthias K. Gobbert, Timothy S. Cale, 2002, Euro-Par.

Surface Evolution During Semiconductor Processing

Ganesh Rajagopalan, Vadali Mahadev, Timothy S. Cale, 1998, VLSI Design.

A computational framework for modelling grain-structure evolution in three dimensions

David F. Richards, Max O. Bloomfield, Timothy S. Cale, 2003 .

A Galerkin Method for the Simulation of the Transient 2-D/2-D and 3-D/3-D Linear Boltzmann Equation

Matthias K. Gobbert, Timothy S. Cale, Samuel G. Webster, 2007, J. Sci. Comput..

Wafer-level 3D system-on-a-chip using dielectric glue wafer bonding and Cu damascene inter-wafer interconnects

Russell P. Kraft, J. J. McMahon, Ronald J. Gutmann, 2003 .

Cluster Computing for Transient Simulations of the Linear Boltzmann Equation on Irregular Three-Dimensional Domains

Matthias K. Gobbert, Timothy S. Cale, Mark L. Breitenbach, 2005, International Conference on Computational Science.

Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2004 .

Stress-Induced Grain Boundary Migration in Polycrystalline Copper

Max O. Bloomfield, Timothy S. Cale, T. Cale, 2008 .

STEP COVERAGE PREDICTIONS USING COMBINED REACTOR SCALE AND FEATURE SCALE MODELS FOR BLANKET TUNGSTEN LPCVD

J. H. Park, Timothy S. Cale, Gregory B. Raupp, 1993 .

Programmed Rate Processing to Increase Throughput in LPCVD

Timothy S. Cale, Gregory B. Raupp, Manoj K. Jain, 1990 .

A Multiscale Elastohydrodynamic Contact Model for CMP

John A. Tichy, Timothy S. Cale, Jongwon Seok, 2003 .

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-Dimensional Integration

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2008 .

Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects

John A. Tichy, Timothy S. Cale, Jongwon Seok, 2004 .

Thermal stresses in 3D IC inter-wafer interconnects

Jing Zhang, Jian-Qiang Lu, Ronald J. Gutmann, 2005 .

Thermal Cycling Effects on Critical Adhesion Energy and Residual Stress in Benzocyclobutene-Bonded Wafers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2005 .

Inverse analysis of material removal data using a multiscale CMP model

Ronald J. Gutmann, John A. Tichy, Timothy S. Cale, 2003 .

Critical Adhesion Energy at the Interface Between Benzocyclobutene and Silicon Nitride Layers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2007 .

Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2006 .

Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Feature scale transport and reaction during low-pressure deposition processes

Vadali Mahadev, Timothy S. Cale, T. Cale, 1996 .

Mechanistic feature-scale profile simulation of SiO2 low-pressure chemical vapor deposition by tetraethoxysilane pyrolysis

Timothy S. Cale, Harry K. Moffat, T. Cale, 2000 .

Soft Elastohydrodynamic Lubrication With Roughness

John A. Tichy, Timothy S. Cale, Jongwon Seok, 2003 .

Formation and evolution of grain structures in thin films

Max O. Bloomfield, Timothy S. Cale, 2004 .

Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2005 .

Stress distribution in chemical mechanical polishing

Timothy S. Cale, K. Holland, T. Cale, 1997 .

Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach

Jian-Qiang Lu, Ronald J. Gutmann, Max O. Bloomfield, 2007 .

3D Integration Based upon Dielectric Adhesive Bonding

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2008 .

A general model for PVD aluminum deposition

Timothy S. Cale, Gregory B. Raupp, T. H. Gandy, 1991, 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference.

Deposition rate dependence of step coverage of sputter deposited aluminum-(1.5%) copper films

Timothy S. Cale, T. Cale, Manoj K. Jain, 1998 .

Mesoscopic scale modeling of microloading during low pressure chemical vapor deposition

Matthias K. Gobbert, Timothy S. Cale, Christian Ringhofer, 1996 .

Flux distributions and deposition profiles from hexagonal collimators during sputter deposition

Timothy S. Cale, T. Cale, Zhou Lin, 1995 .

A Multiscale Simulator for Low Pressure Chemical Vapor Deposition

Matthias K. Gobbert, Timothy S. Cale, Leonard Borucki, 1997 .

Estimating Local Deposition Conditions and Kinetic Parameters Using Film Profiles

Timothy S. Cale, A. Hasper, M. B. Chaara, 1992 .

Model for surface diffusion of aluminum-(1.5%) copper during sputter deposition

Timothy S. Cale, Clarence J. Tracy, T. Cale, 1993 .

Applications of plasma coatings in artificial joints: an overview

Bing Shi, Hong Liang, Timothy S. Cale, 2004 .

Feature Superfilling in Copper Electrochemical Deposition

Timothy S. Cale, Sofiane Soukane, S. Sen, 2002 .

Dielectric GlueWafer Bonding For 3D ICs

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2003 .

Strain Energy Driven and Curvature Driven Grain Boundary Migration in 3D-IC Cu Vias

Max O. Bloomfield, Timothy S. Cale, Chaffra A. Awo-Affouda, 2007 .

Thermal runaway prevention in catalytic packed bed reactor by solid temperature measurement and Control

Kil Sang Chang, Timothy S. Cale, Chul-Kun Cho, 1993 .