Zheng Wan
发表
Dengyue Chen,
Xuan Zhu,
Weibin Chen,
2022,
Acta biomaterialia.
Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder
Wenzhao Li,
Zhijie Ding,
Weibing Guo,
2023,
Materials Characterization.
Zhijie Ding,
Weibing Guo,
Cuixin Chen,
2023,
Materials Science and Engineering: A.