Yi-Shao Lai

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai, 2012, Microelectron. Reliab..

Reliability of high-power LED packaging and assembly

S. W. Ricky Lee, Yi-Shao Lai, C. Y. Liu, 2012, Microelectron. Reliab..

Evaluation of board-level reliability of electronic packages under consecutive drops

Chin-Li Kao, Chang-Lin Yeh, Yi-Shao Lai, 2006, Microelectron. Reliab..