Hiroshi Nishinakayama

Copper Electroplating for Via-Hole and Through-Hole Co-Existed Circuit Boards

H. Honma, Shuhei Miura, K. Oyamada, 2003 .

Electroless Gold Plating Using Erythorbic Acid as Reducing Agent

N. Shinohara, N. Kaneko, H. Nawafune, 2006 .