Y. Pei

Tuning the through-thickness orientation of 1D nanocarbons to enhance the electrical conductivity and ILSS of hierarchical CFRP composites

D. Jiang, S. Ju, K. Duan, 2021 .

Properties and microstructure of Sn–0.7Cu–0.05Ni lead-free solders with rare earth Nd addition

S. Xue, Shuang Liu, Su-juan Zhong, 2018, Journal of Materials Science: Materials in Electronics.

Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

W. Long, Qingke Zhang, Y. Pei, 2015 .