Xiaomin Duan

发表

C. Schuster, Xiaomin Duan, A. Vogt, 2012, International Symposium on Electromagnetic Compatibility - EMC EUROPE.

C. Schuster, Xiaomin Duan, S. Muller, 2012, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility.

Heinz-Dietrich Bruns, Xiaomin Duan, Renato Rimolo-Donadio, 2010, 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility.

Christian Schuster, Heinz-Dietrich Bruns, Sebastian Muller, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Xiaomin Duan, Christian Schuster, Torsten Reuschel, 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI).

Heinz-Dietrich Bruns, Xiaoxiong Gu, Sebastian Muller, 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

C. Schuster, Xiaomin Duan, Y. Kwark, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Heinz-Dietrich Bruns, Sebastian Muller, Xiaomin Duan, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Joungho Kim, Xiaoxiong Gu, Jonghyun Cho, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Klaus-Dieter Lang, Ivan Ndip, Xiaomin Duan, 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).

Bruce Archambeault, Xiaomin Duan, Christian Schuster, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Klaus-Dieter Lang, Ivan Ndip, Xiaomin Duan, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Jun Fan, Xiaoxiong Gu, Y. H. Kwark, 2012, IEEE Transactions on Electromagnetic Compatibility.

Renato Rimolo-Donadio, Xiaomin Duan, Christian Schuster, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Heinz-Dietrich Bruns, Xiaomin Duan, Renato Rimolo-Donadio, 2009, 2009 IEEE Workshop on Signal Propagation on Interconnects.

Xiaomin Duan, Christian Schuster, Jan Birger Preibisch, 2017, IEEE Transactions on Electromagnetic Compatibility.

Cheng Yang, Xiaomin Duan, Renato Rimolo-Donadio, 2021, IEEE Access.

Xiaomin Duan, Renato Rimolo-Donadio, Christian Schuster, 2021, 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI).

Klaus-Dieter Lang, Ivan Ndip, Xiaomin Duan, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Klaus-Dieter Lang, Ivan Ndip, Xiaomin Duan, 2013, 2013 17th IEEE Workshop on Signal and Power Integrity.

Klaus-Dieter Lang, Ivan Ndip, Xiaomin Duan, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Xiaomin Duan, Christian Schuster, Heinz-Dietrich Bruns, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Xiaomin Duan, Renato Rimolo-Donadio, Christian Schuster, 2010, IEEE Transactions on Electromagnetic Compatibility.

Xiaomin Duan, Christian Schuster, Jan Birger Preibisch, 2014, IEEE Transactions on Electromagnetic Compatibility.