Martin Lapisa

Integrating MEMS and ICs

Niclas Roxhed, Fredrik Forsberg, Frank Niklaus, 2015 .

Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Harald Schenk, Wouter van der Wijngaart, Thor Bakke, 2009, MOEMS-MEMS.

The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications

Harald Schenk, Thor Bakke, Hubert Lakner, 2008 .

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

Göran Stemme, Niclas Roxhed, Fredrik Forsberg, 2009 .

Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon

Göran Stemme, Frank Niklaus, Andreas Gehner, 2013 .

Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

Frank Niklaus, Martin Lapisa, Göran Stemme, 2011, IEEE Journal of Selected Topics in Quantum Electronics.