Daniel M. Dreps
发表
Tingdong Zhou,
Wiren D. Becker,
Daniel M. Dreps,
2009,
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
Thomas Toifl,
Martin L. Schmatz,
Michael Ruegg,
2010,
IEEE Journal of Solid-State Circuits.
Matthew M. Ziegler,
Jeffrey A. Zitz,
Pak-kin Mak,
2015,
2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers.
Nanju Na,
Yaping Zhou,
Jinwoo Choi,
2010,
2010 23rd International Conference on VLSI Design.
Wiren D. Becker,
Jose Hejase,
Glen Wiedemeier,
2016,
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Tingdong Zhou,
Thomas-Michael Winkel,
Hubert Harrer,
2009,
IBM J. Res. Dev..
Wiren D. Becker,
Jose A. Hejase,
Sungjun Chun,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Matthew M. Ziegler,
Victor V. Zyuban,
Rahul M. Rao,
2015,
IBM J. Res. Dev..
Ling Zhang,
Wenjian Yu,
Chung-Kuan Cheng,
2008,
2008 45th ACM/IEEE Design Automation Conference.
Ernest S. Kuh,
James F. Buckwalter,
Alina Deutsch,
2009
.
Ling Zhang,
Chung-Kuan Cheng,
Ernest S. Kuh,
2009,
2009 10th International Symposium on Quality Electronic Design.
Matthew M. Ziegler,
Balaram Sinharoy,
Victor V. Zyuban,
2014,
2014 IEEE International Conference on IC Design & Technology.
Christian Menolfi,
Andrea Prati,
Matthias Braendli,
2012,
IEEE Journal of Solid-State Circuits.
Daniel M. Dreps,
Jeffrey Stuecheli,
L. Baba Arimilli,
2018,
IBM J. Res. Dev..
Balaram Sinharoy,
Victor V. Zyuban,
Gaurav Mittal,
2011,
IEEE Journal of Solid-State Circuits.
Tingdong Zhou,
Wolfgang Scholz,
Andreas Huber,
2007,
IBM J. Res. Dev..
Jose A. Hejase,
Junyan Tang,
Daniel M. Dreps,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Sungjun Chun,
Daniel M. Dreps,
Jose Ale Hejase,
2018,
IBM J. Res. Dev..
Wiren D. Becker,
Jose A. Hejase,
Sungjun Chun,
2017,
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Seongwon Kim,
Daniel J. Friedman,
Sergey V. Rylov,
2009,
2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.
Jose A. Hejase,
Daniel M. Dreps,
James D. Jordan,
2014,
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.
Thomas Toifl,
Martin L. Schmatz,
Michael Ruegg,
2010,
2010 IEEE International Solid-State Circuits Conference - (ISSCC).
Rahul M. Rao,
Juergen Pille,
Michael S. Floyd,
2017,
2017 IEEE International Solid-State Circuits Conference (ISSCC).
Yong Kim,
Kevin G. Stawiasz,
Keith A. Jenkins,
2015,
IEEE Journal of Solid-State Circuits.
Wiren D. Becker,
Jose A. Hejase,
Daniel M. Dreps,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Wiren D. Becker,
Jose A. Hejase,
Daniel M. Dreps,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Michael A. Sorna,
David William Mann,
Daniel M. Dreps,
2011
.
Ling Zhang,
Wenjian Yu,
Chung-Kuan Cheng,
2008,
2008 16th IEEE Symposium on High Performance Interconnects.
Seongwon Kim,
Daniel J. Friedman,
Sergey V. Rylov,
2008,
2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.
Nanju Na,
Jose A. Hejase,
Daniel M. Dreps,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Bharat Sukhwani,
Sameh W. Asaad,
Jan van Lunteren,
2017,
2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO).