S. Mao

High temperature characteristics and phase compositions of Cu/Mn multilayers with the different average thickness prepared by electrodeposition

Jianning Ding, P. Guo, L. Yang, 2021 .

The evolution of microstructure and electrical performance in doped Mn-Co and Cu-Mn oxide layers with the extended oxidation time

J. C. Li, P. Guo, Y. Shao, 2020 .

Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

Weijuan Liu, F. Ouyang, S. Mao, 2019, Microelectronics Reliability.

Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications

Kuan-Neng Chen, Han-Wen Hu, S. Mao, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).