Tsgereda Alazar

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Edvin Cetegen, S. Yagnamurthy, V. Subramanian, 2017 .

Symmetric and Asymmetric Double Cantilever Beam Methods for Interfacial Adhesion Strength Measurement in Electronic Packaging

S. Yagnamurthy, P. Malatkar, Pilin Liu, 2016 .

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

Tsgereda Alazar, Leonard R. Sorenson, B. Chandran, 2005 .

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

V. Subramanian, P. Malatkar, Pilin Liu, 2016 .