M. van den Nieuwenhof

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

G. Zhang, S. Koh, H. Ye, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Conductive adhesives for low-stress interconnection of thin back-contact solar cells

M.H.H. Meuwissen, A. Schonecker, D. Meier, 2002, Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002..