L. Liaci

Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test

V. Vinciguerra, G. D'arrigo, A. Sciuto, 2020, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Inhomogeneous Strain Relaxation and Defect Distribution of Znte Layers Deposited on (100)Gaas by Metalorganic Vapor-Phase Epitaxy

F. Romanato, L. Vasanelli, N. Lovergine, 1995 .