S. Guo

发表

Bimaterial curvature measurements for the CTE of adhesives: optimization, modeling, and stability

D. Dillard, Jang-Horng Yu, S. Guo, 2003 .

Strain energy release rates of a pressure sensitive adhesive measured by the shaft-loaded blister test

D. Dillard, T. C. Ward, E. O'brien, 2003 .

Combinatorial and high-throughput measurements of the modulus of thin polymer films

Martin Y.M. Chiang, Christopher Harrison, Christopher M. Stafford, 2005 .

Creep behaviors of a Mg–Li based alloy at elevated temperatures

Z. Ning, Lunyong Zhang, J. Yi, 2021, Materials Science and Engineering: A.

Effect of residual stress on the energy release rate of wedge and DCB test specimens

D. Dillard, Shu Guo, J. Nairn, 2006 .

Adhesive Layer Shrinkage in Bonds Subjected to Thermal Cycling

D. Dillard, Shu Guo, Buo Chen, 2003 .

Effect of boundary conditions and spacers on single-lap joints loaded in tension or compression

R. Plaut, D. Dillard, S. Guo, 2006 .

A bending-to-stretching analysis of the blister test in the presence of tensile residual stress

K. Wan, D. Dillard, S. Guo, 2005 .

Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

S. Qi, S. Guo, G. Tian, 2023, Chinese Journal of Polymer Science.

A theoretical and numerical study of a thin clamped circular film under an external load in the presence of a tensile residual stress

K. Wan, D. Dillard, S. Guo, 2003 .

Integrity of 3LPE Pipeline Coatings: Residual Stresses and Adhesion Degradation

W. Snider, H. Sue, H. Pham, 2008 .

EVALUATION OF THE LONG-TERM DURABILITY OF HIGH-PERFORMANCE POLYIMIDE ADHESIVES FOR BONDING TITANIUM

D. Dillard, Shuangyan Xu, S. Guo, 2004 .