M. Strickland

Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g

P. Lall, J. Blanche, K. Patel, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Reliability of flip chip assemblies subjected to extreme low temperatures

P. Lall, M. Strickland, J.C. Suhling, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

High-G shock reliability of ceramic area-array packages

P. Lall, K. Patel, M. Strickland, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.