Katsumi Terada

Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process

Noboru Asahi, Hiroto Tanaka, Yoshiyuki Arai, 2019, 2019 International 3D Systems Integration Conference (3DIC).

15.1: A New LC Rear‐Projection Display Based on the “Color‐Grating Method”

Takashi Miwa, Yasuo Funazou, Hideyuki Kanayama, 1998 .

High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate

Yasunori Hashimoto, Noboru Asahi, Toshiyuki Jinda, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

3D-IC thermo-compression collective bonding process using high temperature stage

Koichi Imai, Noboru Asahi, Toshiyuki Jinda, 2017, 2017 International Conference on Electronics Packaging (ICEP).