Shizhao Wang

发表

Indenter radius effect on mechanical response of a-(11–20), c-(0001), and m-(-1100) plane GaN single crystals in nanoindentation: A molecular dynamics study

Fang Dong, Gai Wu, Sheng Liu, 2022, Materials Science in Semiconductor Processing.

Research on BEOL Failures of the Chip-Package Interaction by Shear Tests of the Bumps

Sheng Liu, Can Sheng, Rui Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Ultrafast processes simulation under femtosecond laser irradiation of Gallium Nitride thin films

Chaoyue Ji, Cheng Lei, Junheng Pan, 2022, Computational Materials Science.

Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects

Sheng Liu, Shizhao Wang, Yameng Sun, 2022, IEEE Transactions on Electron Devices.

Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process

Sheng Liu, Rui Li, Shizhao Wang, 2022, Microelectronics Reliability.

Study of deformation mechanism of structural anisotropy in 4H–SiC film by nanoindentation

Gai Wu, Sheng Liu, G. Feng, 2022, Materials Science in Semiconductor Processing.

Effects of AlN substrate orientation on crystalline quality of wurtzite GaN films investigated via molecular dynamics

Hui Li, K. Liang, Gai Wu, 2022, Computational Materials Science.

Influence of atomic incident kinetic energy on crystalline quality of epitaxial GaN thin films: A molecular dynamics study

Gai Wu, Sheng Liu, K. Liang, 2022, Materials Science in Semiconductor Processing.

Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices

Sheng Liu, Z. Qian, Kun Ma, 2022, Micromachines.

Study on the prevention of moisture intrusion of different shielding gas environments for stable perovskite solar cells

Qidong Tai, Fang Dong, Sheng Liu, 2023, Solar Energy.

Study of the deposition of nanopillar-patterned 4H-SiC by molecular dynamics simulation

Gai Wu, Sheng Liu, G. Feng, 2021, Applied Surface Science.

Nondestructive monitoring of annealing and chemical–mechanical planarization behavior using ellipsometry and deep learning

Sheng Liu, Yi-Hua Song, Shizhao Wang, 2023, Microsystems & nanoengineering.

Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics

Sheng Liu, Shizhao Wang, Yameng Sun, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application

Fang Dong, Sheng Liu, Hehui Zhang, 2022, Materials Science in Semiconductor Processing.