Yameng Sun

发表

Sheng Liu, Can Sheng, Rui Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Y. Ai, Sheng Liu, Kun Ma, 2022, International Journal of Refractory Metals and Hard Materials.

Sheng Liu, Shizhao Wang, Yameng Sun, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fang Dong, Sheng Liu, Hehui Zhang, 2022, Materials Science in Semiconductor Processing.