D. J. Xie

Fatigue life estimation of surface mount solder joints

I. K. Hui, D. J. Xie, Y. C. Chan, 1996 .

Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

D. J. Xie, Z. P. Wang, Z. P. Wang, 1998 .

Application of direct strain measurement to fatigue studies in surface solder joints

I. K. Hui, D. J. Xie, Y. C. Chan, 1995 .

A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill

D. J. Xie, D. Xie, 2000 .

An experimental approach to pore-free reflow soldering

D. J. Xie, Y. C. Chan, J.K.L. Lai, 1996 .

Experimental studies of pore formation in surface mount solder joints

D. J. Xie, Y. C. Chan, Y. Chan, 1996 .

Porosity formation and its effects on mechanical properties of SMT solder joints

I. K. Hui, D. J. Xie, Y. C. Chan, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Electrical and thermal modelling of QFN packages

A.C.W. Lu, D. J. Xie, D. Xie, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).