N. Imajyo

Steering of surface discharges on through-glass-vias combined with high-density nonequilibrium atmospheric pressure plasma generation

Yoichiro Sato, M. Hori, K. Ishikawa, 2020, Journal of Physics D: Applied Physics.

High rate deposition of μc-Si with plasma gun CVD

N. Imajyo, 1996 .

Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass

R. Tummala, M. Hori, K. Ishikawa, 2019, Journal of Materials Science: Materials in Electronics.

High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers

A. Peterson, V. Sundaram, R. Tummala, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).