M. Volpert

A 10μm pitch interconnection technology using micro tube insertion into Al-Cu for 3D applications

M. Fendler, B. Goubault de Brugiere, F. Marion, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly

C. Kopp, J. Berggren, L. Lombard, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Compact 3D packaging of a photodetector array camera and spectrometer

M. Volpert, A. Vandeneynde, P. Agnese, 2003, 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515).

Ultra fine pitch hybridization of large imaging detectors

M. Fendler, M. Volpert, L. Mathieu, 2003, 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515).

Towards alternative technologies for fine pitch interconnects

L. Di Cioccio, C. Laviron, M. Volpert, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.