Klaus Feldmann

Selection and qualification of polymers for rigid and flexible interconnect applications

Florian Schuessler, Klaus Feldmann, Thomas Bigl, 2007 .

Influences of storage conditions on component cracking

Klaus Feldmann, Robert Feuerstein, Knuth Götz, 1998 .

Reliability aspects of electronic devices for advanced requirements

Michael Rösch, Klaus Feldmann, Florian Schüßler, 2008 .

Montageplanung in Cim

Klaus Feldmann, 1992 .

Moulded Interconnect Devices (MIDs)

Klaus Feldmann, Frank Pöhlau, 1999 .

Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits

Klaus Feldmann, Florian Schüßler, Jochen Borris, 2009 .