Z. Huang

Numerical simulation of the flip-chip underfilling process

A. Tay, Z. Huang, J.H. Wu, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

Characterization of the surface biocompatibility of the electrospun PCL-collagen nanofibers using fibroblasts.

S. Ramakrishna, J. Venugopal, Y. Z. Zhang, 2005, Biomacromolecules.

Fabrication of porous electrospun nanofibres

S. Ramakrishna, Y. Z. Zhang, C. Lim, 2006 .

Mode I Interlaminar Fracture of Composite Laminates Incorporating with Ultrathin Fibrous Sheets

Zheng-ming Huang, Ling-Ling Liu, G. Xu, 2008 .

Simulation of inelastic response of multidirectional laminates based on stress failure criteria

Z. Huang, 2000 .

Micromechanical progressive damage analysis of inter- and intra-layer failures in fiber-reinforced composite laminates

F. Jiang, Z. Huang, R. Batra, 2020 .

Tensile strength of fibrous composites at elevated temperature

Z. Huang, 2000 .

Static and dynamic analysis of the composite laminated stiffened plates via the MLS meshless method

Z. Huang, D. Wei, L. Peng, 2023, Engineering Analysis with Boundary Elements.

Correlation of the bridging model predictions for triaxial failure strengths of composites with experiments

Z. Huang, Y.X. Zhou, 2013 .

The steady state responses of s.d.o.f. viscous elasto-plastic oscillator under sinusoidal loadings

Chein-Shan Liu, Z.-M. Huang, Z. Huang, 2004 .