John H. Lau

发表

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

Gregory Henshall, John H. Lau, Jerry Gleason, 2008 .

Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards

John H. Lau, J. Lau, 2001 .