K. Miwa

发表

Behaviour of particles released from inner walls in an ECR plasma etch tool

H. Arimoto, T. Kamata, K. Miwa, 2000 .

Fluorination mechanisms of Al2O3 and Y2O3 surfaces irradiated by high-density CF4∕O2 and SF6∕O2 plasmas

K. Sasaki, N. Takada, K. Miwa, 2009 .

Influences of reaction products on etch rates and linewidths in a poly-Si/oxide etching process using HBr/O2 based inductively coupled plasma

T. Mukai, K. Miwa, 2002 .

Prediction of etching-shape anomaly due to distortion of ion sheath around a large-scale three-dimensional structure by means of on-wafer monitoring technique and computer simulation

S. Samukawa, T. Iwasaki, T. Kubota, 2013 .

Modification of Fluorinated Al2O3 Surface by Irradiating H2 and O2 Plasmas

K. Sasaki, N. Takada, K. Usami, 2009 .

Low-damage silicon etching using a neutral beam

S. Samukawa, M. Sugiyama, T. Kubota, 2013 .

Effect of neutral beam etching on mechanical property of microcantilevers

S. Samukawa, M. Sugiyama, G. Hashiguchi, 2013 .