T. Lai

发表

Jian Gao, Yunbo He, Hui Tang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Guomin Xia, W. Zou, Hongming Wang, 2022, Materials Research Express.

Yong Liu, Ji-lin Xu, Juntong Huang, 2021, Transactions of Nonferrous Metals Society of China.

W. Hsu, Yi-Fan Li, Wei Chin, 2010 .