D. Manteigas

Dispensing Improvements with Drop on Demand Technology

C. Josserand, T. Séon, E. Cadalen, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Development of selective conformal coating process based on advanced packaging for harsh environments

E. Cadalen, D. Manteigas, O. Maire, 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications

M. Martiny, Sebastien Mercier, L. Bodin, 2014, Microelectron. Reliab..