O. Maire
发表
E. Cadalen,
D. Manteigas,
O. Maire,
2017,
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
J. Renard,
Y. Bienvenu,
O. Maire,
2008,
2008 2nd Electronics System-Integration Technology Conference.
A. Chaillot,
O. Maire,
C. Munier,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
F. Parrain,
A. Bosseboeuf,
M. Woytasik,
2020,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
F. Parrain,
A. Bosseboeuf,
M. Woytasik,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).